An interconnection method for ultra-compliant electrodes.

Vanhoestenberghe A1, Musick KM2, Lacour SP2, Donaldson N1
  • 1. Implanted device Group, Dept of Medical Physics and Bioengineering, UCL, London, United Kingdom
  • 2. Laboratory for Soft Bioelectronic Interfaces, EPFL, Lausanne, Switzerland


Please note that the material presented at the conference includes work in progress; therefore, nothing in the abstracts, papers, or presentations, should be quoted or attributed without first consulting, and obtaining permission from, the authors.



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